April 9–11, 2026, the 14th China Electronic Information Expo (CITE 2026) was grandly held at the Shenzhen Convention & Exhibition Center (Futian). This year’s expo is themed “New Technologies, New Products, New Scenarios,” bringing together more than 1,200 companies in the electronic information sector. An opening summit and more than 30 industry-specific forums will be held concurrently, providing a comprehensive showcase of next-generation electronic information technologies and industrial innovation achievements.

Shanghai Rongrong New Materials Technology Co., Ltd. (hereinafter referred to as “Rongrong New Materials”) brings its independently developed Continuous Alumina Fiber Products Making a major debut, the event is geared toward both upstream and downstream players in the electronic information industry chain, showcasing the company’s innovative applications and core technological strengths in the high-end 3C consumer electronics sector.

At this exhibition, Rongrong New Materials is highlighting continuous alumina fibers and ultra-thin woven fabrics, One-way fabric and various fiber-composite products, which can be widely used in applications such as reinforcement of foldable terminal structures, support for mobile-terminal housings, and thermal insulation and protection of internal components, thereby providing next-generation material solutions that are lightweight, highly reliable, and signal-friendly for high-end 3C electronic products.

As high-end 3C products rapidly evolve toward ultra-thinness, foldability, superior signal stability, and extreme lightweighting, the limitations of traditional materials in areas such as structural strength, signal transmission, and space utilization are becoming increasingly apparent. Leveraging its deep-rooted aerospace-grade technological expertise, Rongrong Alumina Continuous Fiber, with its array of unique properties, offers a fresh approach to upgrading consumer electronics:

(1) Ultra-rigid, ultra-thin design that maximizes internal space in the device

Leveraging our company’s independently developed 8–12 μm ultra-fine fiber technology, the product boasts an exceptionally high tensile modulus of 180–380 GPa. Under the same rigidity requirements, this solution reduces thickness by 20%–40% compared with traditional glass-fiber and metal reinforcement schemes, freeing up valuable internal space on the order of 0.1 mm for end devices. This allows for the integration of higher-capacity batteries and more precise sensors, comprehensively enhancing the core user experience and perfectly meeting the lightweight and thin design demands of foldable screens, ultra-thin laptops, and other cutting-edge devices.

(2) Full-band signal transparency, completely eliminating signal blockage.

Leveraging the intrinsic properties of inorganic nonmetallic materials, the product boasts both a low dielectric constant and low dielectric loss, rendering it “transparent and imperceptible” to electromagnetic waves such as those used in 5G/6G and Wi-Fi—without any signal-shielding effect. It can be seamlessly integrated across all application scenarios, including smartphone frame structures, back panels, and internal supports, eliminating the need for additional signal windows. This fundamentally addresses the signal-blocking challenges inherent in metal housings, ensuring consistent communication speeds and call quality across all frequency bands and enabling terminal designs that strike an optimal balance between aesthetics and functionality.

(3) Aerospace-grade quality, setting the benchmark for end-device reliability

The product is rooted in decades of expertise in aerospace thermal protection technology, inherently possessing High wave transmittance Its core characteristics—high modulus, long-term thermal stability up to 1,200°C, and exceptional ablation resistance—deliver drop- and compression-resistant performance that far exceeds the everyday usage requirements of 3C products. By imbuing end products with a “space-grade” quality endorsement, this material not only meets stringent reliability-testing standards but also significantly enhances brand premium and market competitiveness, providing critical support for the quality upgrade of high-end 3C devices.

(4) High Design Flexibility + Excellent Dielectric Properties Unlock New Possibilities for Terminal Design

This product strikes an optimal balance between superior dielectric performance and exceptional design flexibility, seamlessly integrating with a wide range of molding processes such as can pressing and compression molding. It not only ensures lossless signal transmission but also accommodates customized ID designs, including ultra-thin backplanes and complex-shaped components, thereby completely overcoming the form-factor limitations imposed by traditional materials. This opens up limitless possibilities for differentiated innovation in 3C products and empowers end-brand manufacturers to create more competitive product forms.

Unlike traditional materials such as glass fiber, Rongrong alumina continuous fibers exhibit exceptional properties, including high strength, high modulus, lightweight construction, excellent dimensional stability, and a low coefficient of thermal expansion. Under demanding operating conditions—such as repeated bending in end devices and extreme temperature cycling—they maintain structural integrity and consistent performance over the long term, making them an ideal match for the stringent requirements of high-end 3C products: high precision, high reliability, and extended service life.

The company has achieved continuous fibers of electronic-grade alumina from Sol–gel The company has achieved independent and controllable operation across the entire value chain, from fiber spinning to high-temperature sintering, with three core advantages: 100% proprietary intellectual property rights, 100% domestic sourcing of raw materials, and 100% in-house R&D of the production system. The Shanghai Lingang base boasts scalable production capacity, ensuring stable fulfillment of bulk orders in the 3C electronics sector. Meanwhile, the large-scale production base in Baise, Guangxi has now been fully completed and officially commissioned, further strengthening the company’s ability to provide a reliable supply for domestic substitution initiatives.

In the core competitive dimensions of 3C electronic materials, Rongrong’s products demonstrate distinct advantages:

Performance benchmarked against international top-tier standards: Boasting multiple advantages—including high modulus, ultra-thin form factor, signal-friendly performance, and high-temperature resistance—this product delivers performance that fully matches that of imported brands in applications such as foldable displays and 5G/6G terminals.

Significant cost advantages in domestic substitution: The product price offers a clear advantage over imported brands, significantly reducing material procurement costs for end-user companies.

Outstanding customization capabilities for 3C scenarios: Based on terminal structure and process requirements, we can provide customized products such as ultra-thin fiber fabrics and unidirectional fabrics, perfectly meeting the design demands for lightweight, thin profiles and high performance.

At the exhibition, Rongrong New Materials’ booth drew numerous industry-chain customers from the 3C electronics end-market and the consumer electronics supply chain, who stopped by to discuss potential collaborations. Through on-site product demonstrations, technical-solution matchmaking, and in-depth discussions of specific needs, the company reached preliminary cooperation agreements with several leading firms in the sector, thereby fully validating the market acceptance and application potential of domestically produced high-performance alumina fibers in the high-end 3C segment and laying a solid foundation for further deepening collaboration across the industry value chain.

As a leading enterprise in China’s continuous alumina fiber industry, Rongrong New Materials consistently focuses on the core needs of the high-end 3C electronics sector. Leveraging end-to-end, independently controllable technologies, scalable production capacity, and highly efficient customized services, the company delivers high-performance, highly reliable, and cost-effective material solutions for applications such as foldable smartphones, 5G/6G terminals, ultra-thin laptops, and AR/AI smart glasses.

At CITE 2026, the company will showcase its core products and technological solutions for high-end 3C electronics, further deepening its expertise in structural and functional materials for 3C electronic end devices and accelerating the domestic substitution of critical electronic materials. Rongrong New Materials looks forward to forging close collaborations with industry-chain partners to jointly explore new avenues for the high-quality development of the 3C electronics industry.