April 9–11, 2026 – The 14th China Information Technology Expo (CITE 2026) is grandly held at the Shenzhen Convention & Exhibition Center (Futian). Under the theme “New Technologies, New Products, New Scenarios,” the expo brings together over 1,200 enterprises in the electronic information field, featuring an opening summit and more than 30 industry forums, comprehensively showcasing next‑generation electronic information technologies and industrial innovation achievements.

Shanghai Rongrong New Material Technology Co., Ltd. (hereinafter referred to as “Rongrong New Materials”) makes a major appearance with its self‑developed continuous alumina fiber products , highlighting innovative applications and core technological advantages in the high‑end 3C consumer electronics sector for the upstream and downstream of the electronic information industry chain.

1. Spotlight on CITE 2026: High‑Performance Alumina Fiber Material Empowers All‑Scenario Upgrades of High‑End 3C Electronics

At this exhibition, Rongrong New Materials focuses on displaying continuous alumina fiber, ultra‑thin woven fabrics, unidirectional (UD) sheets, and various fiber composite products. These products can be widely used in foldable device structural reinforcement, mobile device chassis supports, and internal component thermal insulation protection, providing a new‑generation material solution characterized by lightweight construction, high reliability, and signal friendliness for high‑end 3C electronic products.

As high‑end 3C products rapidly evolve toward ultra‑thinness, foldability, high signal stability, and extreme lightweighting, the limitations of traditional materials in structural strength, signal transmission, and space utilization have become increasingly prominent. Building on its aerospace‑grade technological heritage, Rongrong’s continuous alumina fiber offers multiple unique properties that provide a fresh approach for consumer electronics upgrades:

1. Ultra‑Stiff, Ultra‑Thin Design – Freeing Up Internal Space in Devices
Using self‑developed 8–12 µm ultra‑fine fiber technology, the product achieves an ultra‑high tensile modulus of 180–380 GPa. Under the same stiffness requirements, it reduces thickness by 20%–40% compared to traditional glass fiber or metal reinforcement solutions, freeing up valuable internal space in the millimeter range (0.1 mm class). This allows for larger batteries and more precise sensors, enhancing the core user experience and perfectly meeting the slim and lightweight design needs of foldable screens, ultra‑thin notebooks, and other devices.

2. Full‑Band Signal Transparency – Completely Eliminates Signal Shielding
Leveraging the intrinsic properties of inorganic non‑metallic materials, the product features both a low dielectric constant and low dielectric loss, making it “transparent and imperceptible” to electromagnetic waves such as 5G/6G and Wi‑Fi, with no signal shielding effect. It can be applied to mobile phone frames, back covers, internal brackets, and other structural components without the need for additional signal windows, fundamentally solving the signal shielding problem of metal casings. This ensures full‑band communication rates and call quality, allowing terminal product design to return to a balance of aesthetics and functionality.

3. Aerospace‑Grade Quality – Setting a New Benchmark for Terminal Reliability
Originating from aerospace thermal protection technology, the product inherently features high wave transmittance, high modulus, long‑term resistance to temperatures up to 1200 °C, and ablation resistance. Its impact and compression resistance far exceed the daily usage requirements of 3C products. The “space‑grade” quality endorsement not only helps terminals pass stringent reliability tests but also significantly enhances brand value and market competitiveness, providing core support for the quality upgrade of high‑end 3C products.

4. High Designability + Excellent Dielectric Properties – Unlocking New Design Possibilities
The product combines excellent dielectric performance with outstanding designability, making it fully compatible with various molding processes such as compression molding and hydroforming. It ensures unimpeded signal transmission while accommodating personalized ID designs such as ultra‑thin back covers and irregular structural parts. This breaks the molding constraints of traditional materials, offering unlimited possibilities for differentiated innovation in 3C products and helping terminal brands create more competitive product forms.

2. Technical Highlights: Fully Independent & Controllable Domestic Alumina Fiber Leading the 3C Electronics Material Sector

Unlike traditional materials such as glass fiber, Rongrong’s continuous alumina fiber features high strength, high modulus, light weight, excellent dimensional stability, and a low coefficient of thermal expansion. Under repeated bending, high‑low temperature cycling, and other operating conditions of terminal devices, it maintains long‑term structural and performance stability, perfectly meeting the core requirements of high‑end 3C products: high precision, high reliability, and long service life.

The company has achieved full‑industry‑chain self‑reliance for electronic‑grade continuous alumina fiber, including sol‑gel, spinning, and high‑temperature sintering. It possesses three core advantages: 100% proprietary intellectual property, 100% locally sourced raw materials, and 100% self‑developed production systems. The Shanghai Lingang base provides large‑scale production capacity, ensuring stable delivery for batch orders in the 3C electronics field. Moreover, the large‑scale production base in Baise, Guangxi, has now been fully completed and officially put into operation, further consolidating the company’s stable supply capability in the domestic substitution arena.

In the core competitive dimensions of 3C electronic materials, Rongrong’s products stand out clearly:

Performance on par with international leaders: Combining high modulus, ultra‑thinness, signal friendliness, high temperature resistance, and more, the performance fully matches imported brands in scenarios such as foldable screens and 5G/6G terminals.

Significant cost advantage for domestic substitution: Product prices are substantially lower than imported brands, greatly reducing material procurement costs for terminal manufacturers.

Outstanding customization capability for 3C applications: Tailor‑made products such as ultra‑thin fiber fabrics and unidirectional sheets can be provided according to terminal structure and process requirements, perfectly matching the lightweight, high‑performance design needs of devices.

At the exhibition, Rongrong New Materials’ booth attracted numerous industry chain customers from 3C electronics terminals and consumer electronics supply chains, who stopped by for discussions. Through on‑site product displays, technical solution exchanges, and in‑depth discussions of requirements, the company reached preliminary cooperation intentions with several industry leaders, fully validating the market recognition and application potential of domestic high‑performance alumina fiber in the high‑end 3C field, and laying a solid foundation for further deepening industry chain collaboration.

3. Exhibition Outlook: Driving High‑Quality Development of the 3C Electronic Information Industry with Domestic High‑Performance Materials

As a leading enterprise in the domestic continuous alumina fiber sector, Rongrong New Materials has always focused on the core needs of the high‑end 3C electronics industry. Leveraging fully independent and controllable technology across the entire chain, large‑scale production capacity, and efficient customisation services, the company provides high‑performance, high‑reliability, and cost‑effective material solutions for foldable screen phones, 5G/6G terminals, ultra‑thin notebooks, AR/AI smart glasses, and other applications.

At CITE 2026, the company highlights its core products and technical solutions for high‑end 3C electronics, continuing to deepen its presence in the structural and functional material scenarios of 3C electronics terminals and accelerating the domestic substitution of key electronic materials. Rongrong New Materials looks forward to in‑depth cooperation with industry chain partners, jointly exploring new horizons for the high‑quality development of the 3C electronics industry.